Ministry of Education
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Dr Tamal Ghosh

vidwan id: 595663
Male

Assistant Professor (Grade-II), School of VLSI Technology
Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)

Orchid Icon 0000-0003-3032-0163 Google Scholar Icon 57205518921 Researcher Icon MBV-9243-2025 Google Scholar Icon dmHf0ckAAAAJ

Expertise

  • Nanoscience and Nanotechnology

Publications

Total Articles 35
Books 0
Proceedings 0

Publications

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Scopus

Citations 339
h-index 11

CrossRef

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Citations 262
h-index 9
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Professional Recognition

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Community & Membership

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Bio

I am a researcher and academician specializing in microelectronics, VLSI , microfabrication, and analog integrated circuits (ICs). With a focus on the design, development, and optimization of advanced semiconductor devices, exploring innovative solutions in circuit performance, and fabrication techniques.

Personal Details

  • Male
  • Assistant Professor (Grade-II) , Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)
  • Indian Institute of Engineering Science and Technology, Botanical Garden Area, Howrah, West Bengal 711103, India
Ph.D.
Other Institute 2016
Assistant Professor (Grade-II) Aug 2019 – Present
Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University) | School of VLSI Technology

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Co-Authors (10)

Asisa Kumar

Dr Asisa Kumar Panigrahy

Goka Raju Ranga Raju Institute of Engineering & Technology

Ashudeb

Prof Ashudeb Dutta

Indian Institute of Technology Hyderabad

Subrahmanyam

Prof Subrahmanyam Challapalli

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Dr Ch Subrahmanyam

Indian Institute of Technology Hyderabad

Dalia

Dr Dalia Nandi

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Hafizur

Dr Hafizur Rahaman

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Siddhartha P

Dr Siddhartha P Duttagupta

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Shiv Govind

Prof Shiv Govind Singh

Indian Institute of Technology Hyderabad

Siva Rama Krishna

Dr Siva Rama Krishna Vanjari

Indian Institute of Technology Hyderabad

Tamal

Dr Tamal Ghosh

Motilal Nehru National Institute of Technology Allahabad

Scholarly Work

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Scholarly Publications

Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding

Open Access
Conference Paper
Year: 2015. Pages: TS8.13.1-TS8.13.5 .
Authors: Panigrahi A.K.;Bonam S.;Ghosh T.;Vanjari S.R.K.;Singh S.G.
DOI 10.1109/3DIC.2015.7334582
6 7

Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration

Open Access
Conference Paper
Year: 2015. Volume: 2015-July , Pages: 2205-2210 .
Authors: Panigrahi A.K.;Bonam S.;Ghosh T.;Vanjari S.R.K.;Singh S.G.
DOI 10.1109/ECTC.2015.7159909
16 27

Hybrid TTSV structure for heat mitigation and energy harvesting in 3D IC

Open Access
Conference Paper
Year: 2015. Volume: 2015-July , Pages: 1160-1162 .
Authors: Ghosh T.;Gagan G.C.;Dutta A.;Sivaramakrishna V.;Singh S.G.
DOI 10.1109/ECTC.2015.7159741
2 3

Facile non thermal plasma based desorption of self assembled monolayers for achieving low temperature and low pressure Cu-Cu thermo-compression bonding

Open Access
Article
RSC Advances. Year: 2015. Volume: 5 , Issue: 125 , Pages: 103643-103648 .
Authors: Ghosh T.;Krushnamurthy K.;Panigrahi A.K.;Dutta A.;Subrahmanyam C.;Vanjari S.R.K.;Singh S.G.
DOI 10.1039/c5ra17735a
26 28

Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer

Open Access
INPROCEEDINGS
Year: 2014. Pages: 1-4 .
Authors: Ghosh, Tamal and Krishna, V Siva Rama and Singh, Shiv Govind
DOI 10.1109/ICEmElec.2014.7151165

Effect of post deposition annealing on thermal evaporated ZnSe:Te towards a scintillator application

Open Access
Article
Microelectronic Engineering. Year: 2014. Volume: 126 , Pages: 84-87 .
Authors: Chatterjee U.;Das A.;Ghosh T.;Duttagupta S.P.;Gandhi M.N.;Singh S.G.
DOI 10.1016/j.mee.2014.06.016
4 4

Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer

Open Access
Conference Paper
Year: 2014.
Authors: Ghosh T.;Krishna V.S.R.;Singh S.G.
DOI 10.1109/ICEmElec.2014.7151165
1

Stress analysis in 3D IC having Thermal Through Silicon Vias (TTSV)

Open Access
Conference Paper
Year: 2013. Pages: 2337-2341 .
Authors: Patel S.B.;Ghosh T.;Dutta A.;Singh S.
DOI 10.1109/ECTC.2013.6575910
2 2