Ministry of Education
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Dr Tamal Ghosh

vidwan id: 595663
Male

Assistant Professor (Grade-II), School of VLSI Technology
Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)

Orchid Icon 0000-0003-3032-0163 Google Scholar Icon 57205518921 Researcher Icon MBV-9243-2025 Google Scholar Icon dmHf0ckAAAAJ

Expertise

  • Nanoscience and Nanotechnology

Publications

Total Articles 35
Books 0
Proceedings 0

Publications

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Scopus

Citations 339
h-index 11

CrossRef

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Citations 262
h-index 9
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Professional Recognition

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Community & Membership

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Bio

I am a researcher and academician specializing in microelectronics, VLSI , microfabrication, and analog integrated circuits (ICs). With a focus on the design, development, and optimization of advanced semiconductor devices, exploring innovative solutions in circuit performance, and fabrication techniques.

Personal Details

  • Male
  • Assistant Professor (Grade-II) , Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)
  • Indian Institute of Engineering Science and Technology, Botanical Garden Area, Howrah, West Bengal 711103, India
Ph.D.
Other Institute 2016
Assistant Professor (Grade-II) Aug 2019 – Present
Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University) | School of VLSI Technology

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Co-Authors (10)

Asisa Kumar

Dr Asisa Kumar Panigrahy

Goka Raju Ranga Raju Institute of Engineering & Technology

Ashudeb

Prof Ashudeb Dutta

Indian Institute of Technology Hyderabad

Subrahmanyam

Prof Subrahmanyam Challapalli

Indian Institute of Technology Hyderabad

Ch

Dr Ch Subrahmanyam

Indian Institute of Technology Hyderabad

Dalia

Dr Dalia Nandi

Indian Institute of Information Technology, Kalyani

Hafizur

Dr Hafizur Rahaman

Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)

Siddhartha P

Dr Siddhartha P Duttagupta

Indian Institute of Technology Bombay

Shiv Govind

Prof Shiv Govind Singh

Indian Institute of Technology Hyderabad

Siva Rama Krishna

Dr Siva Rama Krishna Vanjari

Indian Institute of Technology Hyderabad

Tamal

Dr Tamal Ghosh

Motilal Nehru National Institute of Technology Allahabad

Scholarly Work

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Scholarly Publications

Thermo-electro-mechanical Effects of Copper TSV Interconnects on the MOS Characteristics in Stacked 3D Integration

Open Access
Conference Paper
Year: 2024. Volume: 974 , Pages: 627-636 .
Authors: Chaudhuri D.;Jamal R.;Rahaman H.;Ghosh T.
DOI 10.1007/978-981-97-2611-0_42

A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding

Open Access
Book Chapter
Year: 2023. Volume: 1004 , Pages: 419-426 .
Authors: Chaudhuri D.;Rahaman H.;Ghosh T.
DOI 10.1007/978-981-99-0055-8_35

A Novel Approach to Model and Analyze Wafer–Wafer Hybrid Bonding

Open Access
book chapter
Year: 2023.
Authors: Debika Chaudhuri, Hafizur Rahaman, Tamal Ghosh

Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal through Silicon Vias

Open Access
Conference Paper
Year: 2020. Pages: 296-299 .
Authors: Chaudhuri D.;Das D.N.;Rahaman H.;Ghosh T.
DOI 10.1109/ICIIS51140.2020.9342651
2

Heat Mitigation in 3D ICs by Improvised TTSV Structure

Open Access
Conference Paper
Year: 2020.
Authors: Chaudhuri D.;Nandi Das D.;Rahaman H.;Ghosh T.
DOI 10.1109/ISDCS49393.2020.9262977
5

Surface Density Gradient Engineering Precedes Enhanced Diffusion; Drives CMOS In-Line Process Flow Compatible Cu-Cu Thermocompression Bonding at 75 °C

Open Access
Article
IEEE Transactions on Device and Materials Reliability. Year: 2019. Volume: 19 , Issue: 4 , Pages: 791-795 .
Authors: Panigrahy A.K.;Ghosh T.;Vanjari S.R.K.;Singh S.G.
DOI 10.1109/TDMR.2019.2952927
19 21

Surface Density Gradient Engineering Precedes Enhanced Diffusion; Drives CMOS In-Line Process Flow Compatible Cu–Cu Thermocompression Bonding at 75 °C

Open Access
ARTICLE
IEEE Transactions on Device and Materials Reliability. Year: 2019. Volume: 19 , Pages: 791-795 .
Authors: Panigrahy, Asisa Kumar and Ghosh, Tamal and Vanjari, Siva Rama Krishna and Singh, Shiv Govind
DOI 10.1109/TDMR.2019.2952927

Diffusion enhanced drive sub 100 °C wafer level fine-pitch Cu-Cu thermocompression bonding for 3D IC integration

Open Access
Conference Paper
Year: 2019. Volume: 2019-May , Pages: 2156-2161 .
Authors: Panigrahy A.K.;Bonam S.;Ghosh T.;Vanjari S.R.K.;Singh S.G.
DOI 10.1109/ECTC.2019.00-24
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