Dr Tamal Ghosh

Male

Assistant Professor (Grade-II), School of VLSI Technology
Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)

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Expertise

Nanoscience and Nanotechnology

Publications

Total Articles 35

Books 0

Proceedings 0

Publications

Scopus

Citations 339

h-index 11

CrossRef

Citations 262

h-index 9

Google Scholar

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Professional Recognition

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Bio

I am a researcher and academician specializing in microelectronics, VLSI , microfabrication, and analog integrated circuits (ICs). With a focus on the design, development, and optimization of advanced semiconductor devices, exploring innovative solutions in circuit performance, and fabrication techniques.

Personal Details

Male
Assistant Professor (Grade-II) , Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)
Indian Institute of Engineering Science and Technology, Botanical Garden Area, Howrah, West Bengal 711103, India

Ph.D.

Other Institute 2016

Assistant Professor (Grade-II) Aug 2019 – Present

Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University) | School of VLSI Technology

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Experts (645+)

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Assistant Professor

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Assistant Professor (Grade-I)

Dr N PRAKASH

Assistant Professor

Mr Mrinmoy Sadhukhan

Research Scholar

Mr Haranath Rakshit

Junior Research Fellow

Organisations (254+)

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Prof Bhabani Prasad Mukhopadhyay

Professor

Dr Amlan Kumar Bairagi

Research Scholar

Assistant Professor

Associate Professor

Professor

Assistant Professor

Dr AVERI MUKHOPADHYAY

Assistant Professor

Dr Asok Adak

Associate Professor

Prof Asoke Kumar Dhar

Professor

Dr Atanu Banerjee

Associate Professor

Co-Authors (10)

Dr Asisa Kumar Panigrahy

Goka Raju Ranga Raju Institute of Engineering & Technology

Prof Ashudeb Dutta

Indian Institute of Technology Hyderabad

Prof Subrahmanyam Challapalli

Indian Institute of Technology Hyderabad

Dr Ch Subrahmanyam

Indian Institute of Technology Hyderabad

Dr Dalia Nandi

Indian Institute of Information Technology, Kalyani

Dr Hafizur Rahaman

Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)

Dr Siddhartha P Duttagupta

Indian Institute of Technology Bombay

Prof Shiv Govind Singh

Indian Institute of Technology Hyderabad

Dr Siva Rama Krishna Vanjari

Indian Institute of Technology Hyderabad

Dr Tamal Ghosh

Motilal Nehru National Institute of Technology Allahabad

Scholarly Work

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Scholarly Publications

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering

Open Access

article

Electronic Materials Letters. Year: 2018.

Authors: Asisa Kumar Panigrahi, Tamal Ghosh, C. Hemanth Kumar, Shiv Govind Singh & Siva Rama Krishna Vanjari

Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu-Cu bonding at sub 200 °c for three-dimensional Integration applications

Open Access

Conference Paper

Japanese Journal of Applied Physics. Year: 2018. Volume: 57 , Issue: 2 .

Authors: Panigrahi A.K.;Kumar C.H.;Bonam S.;Ghosh T.;Vanjari S.R.K.;Singh S.G.

10.7567/JJAP.57.02BC04

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering

Open Access

Article

Electronic Materials Letters. Year: 2018. Volume: 14 , Issue: 3 , Pages: 328-335 .

Authors: Panigrahi A.K.;Ghosh T.;Kumar C.H.;Singh S.G.;Vanjari S.R.K.

10.1007/s13391-018-0037-y

Metal-alloy Cu surface passivation leads to high quality fine-pitch bump-less Cu-Cu bonding for 3D IC and heterogeneous integration applications

Open Access

Conference Paper

Year: 2018. Volume: 2018-May , Pages: 1561-1566 .

Authors: Panigrahi A.K.;Kumar C.H.;Bonam S.;Brince P.K.;Ghosh T.;Paul N.;Vanjari S.R.K.;Singh S.G.

10.1109/ECTC.2018.00237

Dual Damascene Compatible, Copper Rich Alloy Based Surface Passivation Mechanism for Achieving Cu-Cu Bonding at 150 Degree C for 3D IC Integration

Open Access

Conference Paper

Year: 2017. Pages: 982-988 .

Authors: Panigrahi A.K.;Ghosh T.;Vanjari S.R.K.;Singh S.G.

10.1109/ECTC.2017.127

Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration

Open Access

Conference Paper

Year: 2017.

Authors: Kumar Panigrahi A.;Bonam S.;Ghosh T.;Krishna Vanjari S.R.;Govind Singh S.

10.1109/3DIC.2016.7970019

Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration

Open Access

Conference Paper

Year: 2017. Pages: 35 .

Authors: Panigrahi A.K.;Kumar C.H.;Ghosh T.;Vanjari S.R.K.;Singh S.G.

10.23919/LTB-3D.2017.7947431

Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications

Open Access

article

Japanese Journal of Applied Physics. Year: 2017. Volume: 57 , Pages: 02BC04 .

Authors: Panigrahi, Asisa Kumar and Kumar, C. Hemanth and Bonam, Satish and Ghosh, Tamal and Vanjari, Siva Rama Krishna and Singh, Shiv Govind

10.7567/JJAP.57.02BC04

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