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Prof Pradeep Dixit

vidwan id: 155599
Male

Associate Professor,
Indian Institute of Technology Bombay

Expertise

  • Mechanical Engineering

Publications

Total Articles 115
Books 0
Proceedings 0

Publications

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Scopus

Citations 2158
h-index 26

CrossRef

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Citations 682
h-index 15
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Professional Recognition

2023

Department Best Teachers Award

IIT Bombay
2006

Norman Hackerman Young Author Award

Electrochemical Society

Community & Membership

2021

Microsystems Technology

Associate Editor
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Bio

MEMS, Microfabrication, Microsystems Packaging, 3D Interconnections, Non-conventional Machining

Personal Details

  • Male
  • Associate Professor , Indian Institute of Technology Bombay
  • Indian Institute of Technology Bombay, Powai
Ph.D
Other Institute 2008
Associate Professor May 2021 – Present
Indian Institute of Technology Bombay
Assistant Professor Mar 2015 – Apr 2021
Indian Institute of Technology Bombay

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Co-Authors (8)

Suhas S.

Dr Suhas S. Joshi

Indian Institute of Technology Indore

Deepak

Dr Deepak Marla

Indian Institute of Technology Bombay

Akshay

Prof Akshay Dvivedi

Indian Institute of Technology Roorkee

Pradeep

Prof Pradeep Kumar

Indian Institute of Technology Roorkee

Neelesh Kumar

Prof Neelesh Kumar Jain

Indian Institute of Technology Indore

Priyaranjan

Dr Priyaranjan Sharma

Manipal University, Jaipur

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Dr Shalabh Gupta

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Scholarly Work

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Void formation and Intermetallic growth in the Cu-Sn layers for Through glass vias based MEMS Applications

University Indian Institute of Technology Bombay
Year 2020

Experimental Investigations of Through-holes formation in glass by electrochemical discharge machininig

University Indian Institute of Technology Bombay
Year 2020

Electrochemical discharge micromilling to create 3D Microstructures in glass substrate

University Indian Institute of Technology Bombay
Year 2022

Electrochemical discharge micromilling to create 3D Microstructures in glass substrate

University Indian Institute of Technology Bombay
Year 2022

A Method of Electro-Depositing a Conductive Material in at-least One Through-Hole Via a Semiconductor Substrate

Nanyang Technological University
Singapore
- Patent No. : 7,850,836 Filed : 11-09-2006
Published : N/A Granted

Scholarly Publications

Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining

Open Access
Article

Micro array hole formation in glass using electrochemical discharge machining

Open Access
Conference Paper
Authors: Arab J.;Adhale P.;Mishra D.K.;Dixit P.

Fabrication and characterization of through-glass vias by the ECDM process

Open Access
Article

High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique

Open Access
Article

Experimental investigations in the intermetallic and microvoid formation in sub-200° C Cu–Sn bonding

Open Access
article
Authors: Kannojia, Harindra Kumar; Dixit, Pradeep;

Induced stress enhancement using u-shaped arms in a 3-axis piezoresistive MEMS accelerometer

Open Access
Conference Paper
Authors: Hadi Said M.;Tounsi F.;Mezghani B.;Ahmed A.;Pandit S.;Patkar R.;Dixit P.;Baghin M.;Rao V.

Void Formation and Intermetallic Growth in Pulse Electrodeposited Cu-Sn Layers for MEMS Packaging

Open Access
Article

A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators

Open Access
Conference Paper
Authors: Ruffieux D.;Scolari N.;Le T.;Beuchat P.;Jaakkola A.;Pensala T.;Dekker J.;Dixit P.;Manier C.;Zoschke K.;Oppermann H.