Prof Pradeep Dixit

vidwan id: 155599

Male

Associate Professor,
Indian Institute of Technology Bombay

0000-0001-6706-1877 Google Scholar Icon

13405358300

Expertise

Mechanical Engineering

Publications

Total Articles 115

Books 0

Proceedings 0

Publications

Scopus

Citations 2158

h-index 26

CrossRef

Citations 682

h-index 15

Google Scholar

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Professional Recognition

2023

Department Best Teachers Award

IIT Bombay

2006

Norman Hackerman Young Author Award

Electrochemical Society

Community & Membership

2021

Microsystems Technology

Associate Editor

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Bio

MEMS, Microfabrication, Microsystems Packaging, 3D Interconnections, Non-conventional Machining

Personal Details

Male
Associate Professor , Indian Institute of Technology Bombay
Indian Institute of Technology Bombay, Powai

Ph.D

Other Institute 2008

Associate Professor May 2021 – Present

Indian Institute of Technology Bombay

Assistant Professor Mar 2015 – Apr 2021

Indian Institute of Technology Bombay

Related Profiles

Experts (13474+)

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Assistant Professor

Assistant Professor

N/A

Assistant Professor

Assistant Professor

Doctor

Assistant Professor (Grade-I)

Dr N PRAKASH

Assistant Professor

Mr Mrinmoy Sadhukhan

Research Scholar

Mr Haranath Rakshit

Junior Research Fellow

Organisations (592+)

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Dr Bharath Shekar

Assistant Professor

Dr Sibi Raj B Pillai

Assistant Professor

Dr Vivek Shripad Borkar

Professor

Dr Bhaskaran Raman

Professor

Prof BELLIE Siva Kumar

Professor

Dr Bakul Rao

Associate Professor

Dr Balasubramaniam Kavaipatti

Assistant Professor

Prof Petety V Balaji

Professor

Dr Avishek Ranjan

Assistant Professor

Dr Avradeep Pal

Assistant Professor

Co-Authors (8)

Dr Suhas S. Joshi

Indian Institute of Technology Indore

Dr Deepak Marla

Indian Institute of Technology Bombay

Prof Akshay Dvivedi

Indian Institute of Technology Roorkee

Prof Pradeep Kumar

Indian Institute of Technology Roorkee

Prof Neelesh Kumar Jain

Indian Institute of Technology Indore

Dr Priyaranjan Sharma

Manipal University, Jaipur

Prof V. Ramgopal Rao

Birla Institute of Technology and Science

Dr Shalabh Gupta

Indian Institute of Technology Bombay

Scholarly Work

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Void formation and Intermetallic growth in the Cu-Sn layers for Through glass vias based MEMS Applications

University Indian Institute of Technology Bombay

Year 2020

Experimental Investigations of Through-holes formation in glass by electrochemical discharge machininig

University Indian Institute of Technology Bombay

Year 2020

Electrochemical discharge micromilling to create 3D Microstructures in glass substrate

University Indian Institute of Technology Bombay

Year 2022

Electrochemical discharge micromilling to create 3D Microstructures in glass substrate

University Indian Institute of Technology Bombay

Year 2022

A Method of Electro-Depositing a Conductive Material in at-least One Through-Hole Via a Semiconductor Substrate

Nanyang Technological University

Singapore

- Patent No. : 7,850,836 Filed : 11-09-2006

Published : N/A Granted

Scholarly Publications

Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging

Open Access

Article

Year: 2008. Volume: 141 , Issue: 2 , Pages: 685-694 .

Authors: Dixit P.;Lin N.;Miao J.;Wong W.K.;Choon T.K.

10.1016/j.sna.2007.09.006

High aspect ratio vertical through-vias for 3D MEMS packaging applications by optimized three-step deep RIE

Open Access

Article

Journal of The Electrochemical Society. Year: 2008. Volume: 155 , Issue: 2 , Pages: H85-H91 .

Authors: Dixit P.;Miao J.

10.1149/1.2814081

Concept and analytical analysis of silicon micro/nanopillars based 3-D stacked microchannel heat sink for advanced heat dissipation applications

Open Access

Conference Paper

Year: 2007. Pages: 1149-1154 .

Authors: Dixit P.;Lin N.;Miao J.;Wong W.;Teo K.

10.1109/ECTC.2007.373940

Characterization of nano-grained high aspect ratio through-wafer copper interconnect column

Open Access

Conference Paper

Year: 2007. Pages: 2011-2016 .

Authors: Xu L.;Dixit P.;Pang J.H.L.;Miao J.;Zhang X.;Tu K.N.;Preisser R.

10.1109/ECTC.2007.374078

Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects

Open Access

Conference Paper

Journal of Micromechanics and Microengineering. Year: 2007. Volume: 17 , Issue: 9 , Pages: 1749-1757 .

Authors: Dixit P.;Xu L.;Miao J.;Pang J.;Preisser R.

10.1088/0960-1317/17/9/001

Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating

Open Access

Article

Applied Surface Science. Year: 2007. Volume: 253 , Issue: 21 , Pages: 8637-8646 .

Authors: Dixit P.;Chen X.;Miao J.;Divakaran S.;Preisser R.

10.1016/j.apsusc.2007.04.067

Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating

Open Access

Article

Journal of Micromechanics and Microengineering. Year: 2007. Volume: 17 , Issue: 5 , Pages: 1078-1086 .

Authors: Dixit P.;Tan C.;Xu L.;Lin N.;Miao J.;Pang J.;Backus P.;Preisser R.

10.1088/0960-1317/17/5/030

Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Open Access

Article

Applied Physics Letters. Year: 2007. Volume: 90 , Issue: 3 .

Authors: Xu L.;Dixit P.;Miao J.;Pang J.H.L.;Zhang X.;Tu K.N.;Preisser R.

10.1063/1.2432284

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