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Prof Pradeep Dixit

vidwan id: 155599
Male

Associate Professor,
Indian Institute of Technology Bombay

Expertise

  • Mechanical Engineering

Publications

Total Articles 115
Books 0
Proceedings 0

Publications

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Scopus

Citations 2158
h-index 26

CrossRef

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Citations 682
h-index 15
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Professional Recognition

2023

Department Best Teachers Award

IIT Bombay
2006

Norman Hackerman Young Author Award

Electrochemical Society

Community & Membership

2021

Microsystems Technology

Associate Editor
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Bio

MEMS, Microfabrication, Microsystems Packaging, 3D Interconnections, Non-conventional Machining

Personal Details

  • Male
  • Associate Professor , Indian Institute of Technology Bombay
  • Indian Institute of Technology Bombay, Powai
Ph.D
Other Institute 2008
Associate Professor May 2021 – Present
Indian Institute of Technology Bombay
Assistant Professor Mar 2015 – Apr 2021
Indian Institute of Technology Bombay

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Co-Authors (8)

Suhas S.

Dr Suhas S. Joshi

Indian Institute of Technology Indore

Deepak

Dr Deepak Marla

Indian Institute of Technology Bombay

Akshay

Prof Akshay Dvivedi

Indian Institute of Technology Roorkee

Pradeep

Prof Pradeep Kumar

Indian Institute of Technology Roorkee

Neelesh Kumar

Prof Neelesh Kumar Jain

Indian Institute of Technology Indore

Priyaranjan

Dr Priyaranjan Sharma

Manipal University, Jaipur

V. Ramgopal

Prof V. Ramgopal Rao

Birla Institute of Technology and Science

Shalabh

Dr Shalabh Gupta

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Scholarly Work

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Void formation and Intermetallic growth in the Cu-Sn layers for Through glass vias based MEMS Applications

University Indian Institute of Technology Bombay
Year 2020

Experimental Investigations of Through-holes formation in glass by electrochemical discharge machininig

University Indian Institute of Technology Bombay
Year 2020

Electrochemical discharge micromilling to create 3D Microstructures in glass substrate

University Indian Institute of Technology Bombay
Year 2022

Electrochemical discharge micromilling to create 3D Microstructures in glass substrate

University Indian Institute of Technology Bombay
Year 2022

A Method of Electro-Depositing a Conductive Material in at-least One Through-Hole Via a Semiconductor Substrate

Nanyang Technological University
Singapore
- Patent No. : 7,850,836 Filed : 11-09-2006
Published : N/A Granted

Scholarly Publications

Via Technologies for MEMS

Open Access
Book Chapter

Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation

Open Access
Article

Fabrication, electrical characterization and reliability study of partially electroplated tapered copper through-silicon vias

Open Access
Conference Paper
Authors: Dixit P.;Viljanen H.;Salonen J.;Suni T.;Molarius J.;Monnoyer P.

Role of process gases in making tapered through-silicon vias for 3D MEMS packaging

Open Access
Conference Paper
Authors: Dixit P.;Vahanen S.;Salonen J.;Monnoyer P.

Effect of process gases on fabricating tapered through-silicon vias by continuous SF6/O2/Ar plasma etching

Open Access
Article

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

Open Access
Article

The application of dry photoresists in fabricating cost-effective tapered through-silicon vias and redistribution lines in a single step

Open Access
Article

Mechanical and microstructural characterization of through-silicon via fabricated with constant current pulse-reverse modulation

Open Access
Article