Ministry of Education
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Dr Dilip Kumar Maity

vidwan id: 536840
Male

Professor, Computer Science & Engineering
ACADEMY OF TECHNOLOGY

Orchid Icon 0000-0003-3694-6861 Google Scholar Icon 57225429038 Researcher Icon KSM-4272-2024 Google Scholar Icon WCjatkwAAAAJ

Expertise

  • Computer Science Interdisciplinary SCI

Publications

Total Articles 10
Books 0
Proceedings 0

Publications

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Scopus

Citations 45
h-index 5

CrossRef

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Citations 0
h-index 0
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Professional Recognition

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Community & Membership

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IEEE

2023
Member

Bio

VLSI Testing, Fault Tolerance, Yield & Reliability enhancement technique in 3D ICs, IoT Security

Personal Details

  • Male
  • Professor , ACADEMY OF TECHNOLOGY
  • Chinsurah
PhD
Other Institute 2022
Professor Sep 2004 – Present
ACADEMY OF TECHNOLOGY | Computer Science & Engineering

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Dilip Kumar

Dr Dilip Kumar Maity

Professor

Co-Authors (3)

Chandan

Dr Chandan Giri

Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)

Hafizur

Dr Hafizur Rahaman

Indian Institute of Engineering Science & Technology, Shibpur (formerly Bengal Engineering & Science University)

Surajit Kumar

Dr Surajit Kumar Roy

N/A

Scholarly Work

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Scholarly Publications

Built-in Self-prevention (BISP) for runtime ageing effects of TSVs in 3D ICs

Open Access
Article
Year: 2024. Volume: 94 .
Authors: Maity D.K.;Roy S.K.;Giri C.
DOI 10.1016/j.vlsi.2023.102088
1

Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs

Open Access
Article
Microelectronics Reliability. Year: 2023. Volume: 151 .
Authors: Maity D.K.;Roy S.K.;Giri C.
DOI 10.1016/j.microrel.2023.115255
1

A Cost-Effective Built-In Self-Test Mechanism for Post-Manufacturing TSV Defects in 3D ICs

Open Access
Article
ACM Journal on Emerging Technologies in Computing Systems. Year: 2022. Volume: 18 , Issue: 4 .
Authors: Maity D.K.;Roy S.K.;Giri C.
DOI 10.1145/3517808
5

A cost-effective repair scheme for clustered TSV defects in 3D ICs

Open Access
Article
Microelectronics Reliability. Year: 2022. Volume: 129 .
Authors: Maity D.K.;Roy S.K.;Giri C.
DOI 10.1016/j.microrel.2021.114460
3

TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield Improvement of 3-D ICs

Open Access
Article
Year: 2021. Volume: 40 , Issue: 8 , Pages: 1500-1510 .
Authors: Maity D.K.;Roy S.K.;Giri C.
DOI 10.1109/TCAD.2020.3021341
9

Built-in self-repair for manufacturing and runtime TSV defects in 3D ICs

Open Access
Conference Paper
Year: 2020.
Authors: Maity D.K.;Roy S.K.;Giri C.
DOI 10.1109/ITCIndia49857.2020.9171797
7

Identification of Random/Clustered TSV Defects in 3D IC During Pre-Bond Testing

Open Access
Article
Year: 2019. Volume: 35 , Issue: 5 , Pages: 741-759 .
Authors: Maity D.K.;Roy S.K.;Giri C.
DOI 10.1007/s10836-019-05824-w
8

Identification of Faulty TSVs in 3D IC during Pre-Bond Testing

Open Access
Conference Paper
Year: 2018. Volume: 2018-January , Pages: 109-114 .
Authors: Maity D.K.;Roy S.K.;Giri C.
DOI 10.1109/VLSID.2018.46
3