Prof Ramanathan Srinivasan
vidwan id: 51421
Professor, Department of Chemical Engineering
Indian Institute of Technology Madras
Expertise
- Chemical Engineering
Publications
Publications
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Scopus
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23
CrossRef
Citations
2044
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20
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Professional Recognition
Sri S.K. Seshadri Memorial Mascot National Award
Electrochemical Society of IndiaCommunity & Membership
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Electrochemical Society of India (ECSI)
NACE
ISE (International Society of Electrochemistry)
IIChE (Indian Institute of Chemical Engineers)
Electrochemical Society, USA
Bio
Electrochemistry, Corrosion, Electrodeposition, Impedance Spectroscopy
Personal Details
- Male
- Professor , Indian Institute of Technology Madras
- Indian Institute of Technology, Madras
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Experts (1988+)
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Organisations (719+)
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Co-Authors (17)
Indian Institute of Technology Madras
Chaitanya Bharathi Institute of Technology, Hyderabad
Indian Institute of Technology Madras
Indian Institute of Technology Madras
National Institute of Technology Calicut
Indian Institute of Technology Madras
Indian Institute of Technology, Palakkad
Dr Karthik Subramaniam Pushpavanam
Indian Institute of Technology Gandhinagar
Indian Institute of Technology Madras
Indira Gandhi Centre for Atomic Research (IGCAR), Kalpakkam
Indian Institute of Technology Madras
National Institute of Technology, Raipur
Dr Prasanna Venkatesh Rajaraman
Indian Institute of Technology Guwahati
National Institute of Technology, Raipur
Indian Institute of Technology Madras
Anna University
Indian Institute of Technology Madras
Scholarly Work
Development of electrochemical impedance spectroscopy as a tool for malaria, chikungunya and dengue diagnosis
Funding Agency: DBT
Co-PI
23,98,440
2016 - 2019
Mechanistic investigations of electrochemical reactions using nonlinear EIS
Funding Agency: Department of Science and Technology, Govt. of India
PI
45,74,500
2015 - 2018
CIGS Solar Cell fabrication
Funding Agency: Department of Science and Technology, Govt. of India
PI
93,90,973
2013 - 2016
Studies on Fermentation and Drying of Cocoa beans
Funding Agency: Cadbury Inc
Co-PI
9,60,000
2008 - 2009
Experimental and theoretical investigations of Microwave Melting of metals
Funding Agency: CSIR
Co-PI
8,88,000
2007 - 2010
Development of Ice bonded abrasive polishing process
Funding Agency: ARDB
Co-PI
16,32,480
2007 - 2010
Effect of additives on Chemical Mechanical Planarization slurries
Funding Agency: Department of Science and Technology, Govt. of India
PI
22,04,400
2006 - 2009
Fine Particle Application in High Precision Manufacturing Semiconductor Water Surface Contamination
Funding Agency: Department of Science and Technology, Govt. of India
Co-PI
23,58,000
2006 - 2008
Experimental characterization of additive effects on particle size distribution and removal rate in Chemical Mechanical Planarization
Funding Agency: MHRD
PI
1,500,000
2005 - 2007
Characterization of Chemical Mechanical Planarization of Copper using Electrochemical Methods
Funding Agency: MHRD
PI
1,500,000
2004 - 2006
Mechanistic analysis of anodic dissolution of group iv Valve metals in hf using electrochemical techniques
Characterization of electrochemical systems using electrochemical impedance spectroscopy (eis) and mechanistic analysis
Characterization and modification of ceria abrasives for shallow trench isolation chemical mechanical polishing
Experimental studies on microwave heating of metals and graphite based powder mixtures
Electrochemical characterization of copper dissolution in chemical polishing slurries .
Effect of additives on shallow trench isolation(STI) chemical mechanical planarization (CMP) slurries .
Electrochemical aspects of copper, tantalum and ruthenium under chemical mechanical planarization conditions .
CMP of STI and Cu internconnects in microelectronic fabrication
A METHOD TO IDENTIFY PROCESSES, THEIR INTERACTIONS AND SYSTEM STABILITY USING NONLINEAR ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY
INDIAN INSTITUTE OF TECHNOLOGY MADRAS
LANTHANUM DOPING OF CERIA ABRASIVE TO OBTAIN ROBUST CMP POLISH RATES
INDIAN INST TECHNOLOGY MADRAS | INDIAN INSTITUTE OF TECHNOLOGY MADRAS
Scholarly Publications
Insitu characterization of Cu CMP with peroxide based slurries containing arginine as complexing agent
Open AccessChemical mechanical planarization of copper in alkaline slurry with uric acid as inhibitor
Open AccessThe effect of Hydrazine on Copper CMP in Nitric Acid Based Slurries
Open AccessParticle science and technology education and research at IIT madras: A synergistic approach
Open AccessRole of amino-acid adsorption on silica and silicon nitride surfaces during STI CMP
Open Access
10.1149/1.2351957
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